The impetus for the purchase of new software came from the need to:

• produce higher structural classes

• organize PCB blanks efficiently

• centralize PCBs (plating optimization)

• compensate motifs for optimal etching

• save time for data preparation staff


• eliminate the fallible human factor



The technological demands of the higher structural classes made it necessary to purchase a new camera guided drilling rig. We have managed to improve, refine, streamline and accelerate the drilling process. We are now able to drill holes of 0.1 mm diameter, including blind holes.



The next logical step for the improvement of the structural classes was the purchase of a fixer module. The fixer module enables us to offer customers PCBs with both blind holes and buried holes. 



The new exposer was bought for the following four main reasons:

• to increase quality

• to increase productivity

• to shorten production times

• automatic guidance feature 



For us, the quality of the boards we produce is utmost, so investing in testing and quality is nothing unusual. When an electric test is required, or the complexity of the product requires it, we test 100% of our products.




The ever increasing demands from customers to generate measurement protocols reassured us that it was necessary to invest in the measurement and verification fields in order to satisfy those needs. 


Once again, it was our customers and detailed market research that directed our invest in a new gold immersion line. With the support of the line manufacturer and the chemicals supplier we succeeded in fine tuning the process within three months and subsequently started full-scale production. 



Inspecting the applied surface is an integral part of the immersion gold plating process. It is essential for the issuance of a certificate for the customer. The certificate specifies the thickness of the deposited layer of nickel and gold on the product. For us it is not only important to inspect and measure our products, but to be able to repeat every process through which the product has passed. 



With the increase in the production of aluminium PCBs came the need to purchase new grooving equipment. The purchased machine is equipped with direct tool cooling. This technology enables us to produce aluminium PCBs without unsightly burring.



Due to the increase in aluminium plate production, a bottleneck developed at the milling stage. It was therefore necessary to alleviate this by purchasing a new cutter with two separate feeders and two spindles. Each spindle is equipped with its own camera so that it is possible to guide the blanks individually.







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