Technological capabilities

Data processing

                     
  Motifs Gerber 274X, Eagle version 3.55 and higher, CAM 350 version 6 and higher, UCAM, ODB++  
                     
  Drilling Excellon, Sieb & Meyer  
                     

 

Basic materials

 

 
Material designation

Material type

Tg (°C)

Link
 
 
  FR 4 DE 104 135 datasheet  
 
  FR 4 IS 400 150 datasheet  
 
  FR 4 FR95-N 135 datasheet  
 
  FR 4 370 HR 180 datasheet  
 
  IMS Al-Substrate COBRITHERM-ALCUP 120 datasheet  
 
  IMS Al-Substrate MP 06503   90 datasheet  
 
  IMS Al-Substrate HA 50 120 datasheet  
 
  IMS Cu-Substrate H 140A 130 datasheet  
 

 

Production formats

 

 
Material type

Stock [mm]

Usable area [mm]
 
         
  FR4, CEM1 288 x 533 248 x 493  
  385 x 533 345 x 493  
  457 x 609 417 x 569  
                     
  Al and Cu PCB 457 x 609 417 x 569  
  304 x 457 264 x 417      
                     
  Multi-layer PCB 385 x 533 335 x 483  
         

 

Products

 

 
PRODUCTS

INITIAL BASE MATERIAL (Cu) THICKNESS
 
  Standard Advanced  
                     
  Single-layer PCB 18, 35, 70 [µm] 105 [µm]  
                     
  Double-layer PCB 18, 35, 70 [µm] 105, 210 [µm]  
                     
  Multi-layer PCB 4 - 6 layers 8 - 12 layers  
                     
  Planar transformers 18, 35, 70 [µm] 105, 210 [µm]  
                     
  IMS Al + Cu 18, 35, 70 [µm]    
                     
  IMS Al lisovaný 18, 35, 70 [µm]    
                     
  Embedded DPS 18, 35, 70 [µm] 105 [µm]  
                     
  Drilled, etched and laser templates As per customer request  
                     

 

Production capabilities

 

                     
  Maximum PCB thickness 4,2 mm          
                     
  Minimum PCB thickness 0,3 mm          
                     
  Copper-filled via tolerances do Ø 1,5 mm ± 0,10 mm      
  nad Ø 1,5 mm ± 0,15 mm        
                     

 

Motif

 

 
Initial Cu thickness (µm)

Min. line width (mm)

Min. line spacing (mm)

Min. annular ring size (mm)
 
                     
  18   0,125 0,125 0,125  
                     
  35   0,150 0,150 0,150  
                     
  50   0,300 0,300 0,300  
                     
  70   0,350 0,300 0,350  
                     
  105   0,500 0,500 0,500  
                     
  210   Per motif  
                     

 

Technology

 

 
technology

parameter

standard

advanced
 
                     
  DRILLING Drill diameter 0,5 mm 0.2 mm  
  ASPECT RATIO
(drill diameter/
PCB thickness)
1:6 1:10  
  Buried via     0.2 mm  
  Blind via   0.2 mm  
 
  Holes > 0.5 mm inclusive, increment by 0.1 mm, to give the original size approx.  
  At customer's request we can increase the holes > 0.5 mm (must be specified in the order).  
  Min. We only count on the motif of the motif after the drills have been increased.  
  E.g. hole 1mm to 1.1 mm, min. the pad size for the initial Cu of 35 µm is therefore  
  2 x 0,15 + 1,1 = 1,4 mm.  
                     
                     
  MILLING Tool diameter 1,6 mm 0,7 mm  
  Milling tolerance ± 0,2 mm ± 0,1 mm  
  Min. distance motif from PCB edge - 0,2 mm    
                     
                     
  ROUTING Routing tolerance ± 0,2 mm ± 0,1 mm  
  Min. distance motif from PCB edge - 0,5 mm    
                     
                     
  NON-SOLDER MASK Colour Green Black Red  
  Blue White  
  minimum width 150 µm 200 µm  
  minimum gap 150 µm 200 µm  
  increase over motif 100 µm 100 µm  
             
             
  ID PRINT Colour White Black  
  Min. print thickness 200 µm 180 µm  
                     
                     
  REMOVABLE VARNISH Hole covering up to 1,5 mm      
  Solder pad overlap min. 0,100 mm      
  Distance from solder pad min. 0,400 mm    
                     
                     
  GRAPHITE PASTE Line width min. 0,500 mm      
  Space width min. 0,500 mm      
  Contact pad overlap min. 0,250 mm edge overlap  
                     
                     
  VIA FILLING Hole diameter 0,5 mm 0,3 mm nebo > 1,5 mm  
                     

 

Surface treatment

 

 
Type / Name

Description
 
 
  HAL (lead-free) Solder is applied to areas which are not covered with non-solder mask. The HAL solder thickness ranges from 2 to 40 µm depending on the connection density and PCB aspect ratio.  
   
   
                     
                     
  Au - chemical (immersion Au) Nickel thickness ranges from 3 - 6 µm; gold thickness from 0.05 – 0.1 µm.  
                     
                     
  OSP Transparent organic layer is applied to areas which are not covered with non-solder mask. Layer thickness is approx. 0.1 to 0.6 µm.  
                     
                     
  COOPERATION Sn (chemical) Tin thickness ranges from 0.6 – 1.2 µm.  
                     
                     
  COOPERATION HAL (leaded) The solder is applied to places that are not covered by a solder mask. HAL thickness ranges from 2 to 40 µm, depending on joint density and drilling ratio to PCB thickness.  
                     

 

Testting

 

 
Test type

Equipment
 
                     
  AOI optical test Barco Accu Match 2, PRO X2  
                     
                     
  Electrical test ATG A1000, Speedy Pegasus FPT, ATG A5 neo  
                     
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